Custom Heat Sinks Built to Your Thermal Spec
From first simulation to production shipment — engineered heat sinks for electronics manufacturers, OEM buyers, and thermal engineers who can't afford field failures.
0.2 mm
Minimum fin thickness (skived)
500 W/cm²
Vapor chamber heat flux rating
4–6 wk
Production extrusion tooling
Al · Cu · VC
Aluminum, copper, vapor chamber
Why Engineers Specify Custom Heat Sinks
Off-the-shelf sinks leave thermal performance on the table. A heat sink designed for your exact power map, airflow path, and mounting envelope performs 20–40% better than the nearest catalog part.
Precision Thermal Engineering
Every custom heat sink starts with CFD thermal simulation. We model your heat load, airflow constraints, and ambient conditions before cutting a single piece of metal — so the first prototype performs.
Geometry Without Compromise
Extruded, skived, folded fin, bonded fin, forged, die-cast, or vapor chamber — we match the manufacturing process to your power density, envelope, and volume requirements.
From Prototype to Production
Rapid prototype tooling for engineering validation, then seamless transition to high-volume production tooling. One supplier, consistent thermal performance at every run size.
Integrated Mounting & Assembly
Heat sinks delivered with TIM pre-applied, clips installed, and mounting hardware attached. Reduces your assembly line steps and eliminates interface resistance variability.
Material Expertise
6063-T5 aluminum for standard applications, copper for high-flux hotspots, graphite composites for weight-sensitive designs. We source and certify materials to your spec.
Fast Tooling Turnaround
Production extrusion tooling in 4–6 weeks. Rapid prototypes via CNC machining or skiving within days. We compress your thermal validation cycle without cutting corners.
Heat Sink Types & Technologies
The right manufacturing process depends on your power density, volume, and budget. Here's how we match technology to application.
Extruded Aluminum Heat Sinks
The industry workhorse for board-level and chassis cooling. Custom die extrusion produces complex fin geometries at low per-unit cost. Ideal for volumes above 500 units. Finishes include anodize, chromate, and powder coat.
Fin pitch: 1.5–8 mm | Heights to 150 mm | Lengths cut to ±0.5 mm
Applications: Power supplies, motor drives, LED drivers, industrial controls
Skived Fin Heat Sinks
Skiving cuts ultra-thin fins directly from a solid billet — no bonding, no interface resistance. Produces fin-to-base ratios above 40:1 that are impossible with extrusion. Best-in-class surface area for forced-air applications.
Fin thickness: 0.2–0.5 mm | Fin density: up to 26 fins/inch | Materials: Al, Cu
Applications: Server processors, RF amplifiers, IGBT modules, EV inverters
Folded Fin Heat Sinks
Corrugated fin strips brazed or epoxy-bonded to a base plate. Optimized for low-profile, high-airflow cold plates and chassis cooling. Fin geometry tuned to match your fan curve for minimum thermal resistance.
Profile heights: 5–50 mm | Fin pitch: 1.0–4.0 mm | Base: Al or Cu
Applications: Telecom chassis, data center switching, embedded computing
Vapor Chamber Heat Sinks
Two-phase heat spreading eliminates hotspots before they reach fins. Vapor chambers reduce junction-to-sink resistance by 30–50% over solid aluminum in high-flux applications. Available with integrated fin stacks.
Spreader thickness: 3–10 mm | Heat flux: up to 500 W/cm² | Custom form factor
Applications: GPU cooling, high-power laser diodes, phased-array radar, medical imaging
Industries We Serve
Thermal management is a constraint in nearly every power electronics application. These are the sectors where custom heat sinks make the largest performance difference.
Electronics Manufacturing
PCB designers and hardware engineers rely on custom heat sinks to hit junction temperature targets without blowing up the BOM. We work from your thermal design guide to production-ready parts.
OEM & Contract Manufacturing
OEMs need a thermal supplier who can hold tolerances, certify materials, and meet blanket PO schedules. We integrate with your MRP system and provide COAs on every shipment.
Defense & Aerospace
MIL-spec materials, controlled processing, ITAR compliance, and traceability from billet to finished part. Custom heat sinks for avionics, radar, and ruggedized electronics.
EV & Power Electronics
Liquid cold plates and high-density extruded sinks for IGBT, SiC MOSFET, and GaN power modules. Designed to survive thermal cycling, vibration, and aggressive coolant chemistry.
From Spec to Shipment
Our engineering process is designed to give you a validated thermal solution — not just a part.
Thermal Requirements Review
You share your power dissipation, temperature targets, airflow, and envelope. Our engineers review and flag any red flags before simulation.
CFD Simulation
We model your geometry in computational fluid dynamics software. You receive a thermal resistance report with Rθja curves versus airflow before any tooling is cut.
Prototype & First Article
CNC or skived prototypes for engineering validation. We build to your drawing, test to your spec, and provide dimensional and thermal report.
Production & Delivery
Production tooling, in-process QC, material certificates, and scheduled delivery to your dock. We integrate with your MRP for blanket PO management.
Thermal Engineers, Not Just Fabricators
Most heat sink suppliers quote from a catalog or tweak an extrusion die. We start with physics. Our engineering team runs thermal simulations, reviews your board layout, and designs a heat sink that hits your Tj target — not one that comes close.
That means fewer prototype spins, no last-minute board respins to make room for a bigger sink, and production parts that perform identically to the prototype you qualified.
Frequently Asked Questions
What information do I need to provide to get a custom heat sink quote?
At minimum: power dissipation (watts), maximum allowable junction or case temperature, ambient temperature, available airflow (CFM or m/s), and envelope constraints (length × width × height). A component datasheet is helpful. If you have a preliminary thermal simulation or existing design, share it — we can work from concept sketches all the way to CAD files.
What is the typical lead time for a custom heat sink prototype?
CNC-machined prototypes are typically 5–10 business days from drawing approval. Skived fin prototypes run 7–14 days. If you need custom extrusion tooling, plan 4–6 weeks for the die, then 1–2 weeks for first article. We offer expedite options that compress these windows by 30–40% for project-critical timelines.
What materials do you work with?
Aluminum (6063-T5, 6061, 1050) covers 80% of applications. Copper (C11000) for high-flux hotspot applications where thermal conductivity matters more than weight. Graphite composite and vapor chambers for extreme power density. All materials are supplied with certifications; aerospace and defense programs include full lot traceability.
Do you offer thermal simulation before committing to tooling?
Yes, and we recommend it. CFD thermal analysis on your specific geometry and heat load saves you tooling cost when assumptions turn out to be wrong. We run simulations in-house and deliver a thermal resistance report showing Rθja and Rθjc versus airflow curves before you approve tooling.
Can you supply heat sinks with thermal interface material pre-applied?
Yes. We apply phase-change TIM, graphite pads, or thermal grease to your specified interface area prior to shipment. This eliminates application variability in your assembly line and ensures consistent contact resistance. We can also install clips, springs, and mounting hardware.
What are your minimum order quantities?
For CNC-machined or skived prototypes: 1–10 pieces. For extruded aluminum: 50–100 pieces minimum once tooling is amortized. For high-volume production programs, we work on blanket POs with scheduled releases. There is no maximum — we've produced single engineering samples and multi-thousand-unit annual programs from the same account.
Request a Custom Heat Sink Quote
Tell us about your thermal challenge. Power dissipation, temperature targets, envelope constraints — the more detail you share, the faster we can turn a quote.